Новый
Срок поставки: 21 дн.
Характеристики
Available Colors: Black
Bios Features: Plug and Play (PnP) PCI 2.2 ACPI up to 3.0 USB Keyboard support
Bios Type: 128Mb SPI Flash EEPROM with AMI® BIOS
Buttons: Power On/Off button KVM button
Chipset: Intel® C622 chipset
Цвет: Black
Connector: SUV (Serial/USB/Video) & KVM Connector
Cores: Up to 28 Cores
Cpu: Quad Socket P (LGA 3647) 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors ‡ , 3 UPI up to 10.4GT/s Support CPU TDP up to 165W
Совместимые процессоры: 2nd Gen Intel Xeon Scalable and Intel Xeon Scalable
Сокет процессора: Quad Socket P (LGA 3647)
Depth: 23.5"
Environmental Spec: Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)
Форм-фактор: Processor Blade
Graphics: Aspeed AST2500 BMC
Height: 13"
Hot Swap: 4 Hot-Plug 2.5" NVMe/SAS3/SATA3 drive bays
Горячезаменяемые отсеки: 4 x 2.5 NVMe/SAS3/SATA3
Ipmi: Support for Intelligent Platform Management Interface (IPMI) v.2.0 via Chassis Management Module (CMM)
Kvm: 1 Front Connector for SMCI KVM Card
Leds: Power LED UID / KVM LED Network Activity LED Fault LED
Слоты M.2: 2
M 2: 2 PCI-E x4 connector for 2 M.2
Макс. количество ядер: 28
Макс. TDP процессора: 165 W
Макс. объем памяти: 12 TB
Memory Capacity: 48 DIMM slots Up to 12TB 3DS ECC DDR4-2933MHz † RDIMM/LRDIMM Supports Intel® Optane™ DCPMM ††
Слоты памяти: 48
Скорость памяти: 2933/2666/2400 MHz
Тип памяти: DDR4 RDIMM/LRDIMM
Network Controllers: Dual 10G LAN with Intel® X722 and High speed network options via 25G/50G/100G/EDR Mezzanine card
Влажность хранения: 5 ~ 95 %
Температура хранения: -40 ~ 60 °C
Note: ‡ BIOS version 3.0a or above is required to support 2nd Gen. Intel® Xeon® Scalable processors
Рабочая влажность: 8 ~ 90 %
Рабочая температура: 10 ~ 35 °C
Поддержка RAID: 0, 1, 5, 10
Rohs: RoHS Compliant
Sas: Broadcom 3108 SAS3 (12Gbps) controller; HW RAID 0, 1, 5, 10 support; 2G Cache SAS3 mezz card
SAS-контроллер: Broadcom 3108 SAS3 (12Gbps)
Sbi 8149P C4N: Processor Blade SBI-8149P-C4N (Black)
Tpm: 1 TPM Header
Разъем TPM: 1
Type: 2933 † /2666/2400MHz ECC DDR4 RDIMM/LRDIMM
Weight: 24.2 lbs (11.0 kg)
Width: 1.75"
| Available Colors | Black |
|---|---|
| Bios Features | Plug and Play (PnP) PCI 2.2 ACPI up to 3.0 USB Keyboard support |
| Bios Type | 128Mb SPI Flash EEPROM with AMI® BIOS |
| Buttons | Power On/Off button KVM button |
| Chipset | Intel® C622 chipset |
| Цвет | Black |
| Connector | SUV (Serial/USB/Video) & KVM Connector |
| Cores | Up to 28 Cores |
| Cpu | Quad Socket P (LGA 3647) 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors ‡ , 3 UPI up to 10.4GT/s Support CPU TDP up to 165W |
| Совместимые процессоры | 2nd Gen Intel Xeon Scalable and Intel Xeon Scalable |
| Сокет процессора | Quad Socket P (LGA 3647) |
| Depth | 23.5" |
| Environmental Spec | Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
| Форм-фактор | Processor Blade |
| Graphics | Aspeed AST2500 BMC |
| Height | 13" |
| Hot Swap | 4 Hot-Plug 2.5" NVMe/SAS3/SATA3 drive bays |
| Горячезаменяемые отсеки | 4 x 2.5 NVMe/SAS3/SATA3 |
| Ipmi | Support for Intelligent Platform Management Interface (IPMI) v.2.0 via Chassis Management Module (CMM) |
| Kvm | 1 Front Connector for SMCI KVM Card |
| Leds | Power LED UID / KVM LED Network Activity LED Fault LED |
| Слоты M.2 | 2 |
| M 2 | 2 PCI-E x4 connector for 2 M.2 |
| Макс. количество ядер | 28 |
| Макс. TDP процессора | 165 W |
| Макс. объем памяти | 12 TB |
| Memory Capacity | 48 DIMM slots Up to 12TB 3DS ECC DDR4-2933MHz † RDIMM/LRDIMM Supports Intel® Optane™ DCPMM †† |
| Слоты памяти | 48 |
| Скорость памяти | 2933/2666/2400 MHz |
| Тип памяти | DDR4 RDIMM/LRDIMM |
| Network Controllers | Dual 10G LAN with Intel® X722 and High speed network options via 25G/50G/100G/EDR Mezzanine card |
| Влажность хранения | 5 ~ 95 % |
| Температура хранения | -40 ~ 60 °C |
| Note | ‡ BIOS version 3.0a or above is required to support 2nd Gen. Intel® Xeon® Scalable processors |
| Рабочая влажность | 8 ~ 90 % |
| Рабочая температура | 10 ~ 35 °C |
| Поддержка RAID | 0, 1, 5, 10 |
| Rohs | RoHS Compliant |
| Sas | Broadcom 3108 SAS3 (12Gbps) controller; HW RAID 0, 1, 5, 10 support; 2G Cache SAS3 mezz card |
| SAS-контроллер | Broadcom 3108 SAS3 (12Gbps) |
| Sbi 8149P C4N | Processor Blade SBI-8149P-C4N (Black) |
| Tpm | 1 TPM Header |
| Разъем TPM | 1 |
| Type | 2933 † /2666/2400MHz ECC DDR4 RDIMM/LRDIMM |
| Weight | 24.2 lbs (11.0 kg) |
| Width | 1.75" |
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