Характеристики

Фильтр 44

Available Colors: Black Bios Features: Plug and Play (PnP) PCI 2.2 ACPI up to 3.0 USB Keyboard support Bios Type: 128Mb SPI Flash EEPROM with AMI® BIOS Buttons: Power On/Off button Размер кэша: 2 GB Chipset: Intel® C622 chipset Цвет: Black Cores: Up to 28 Cores Cpu: Dual Socket P (LGA 3647) 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors ‡ , 3 UPI up to 10.4GT/s Support CPU TDP up to 205W Серия процессора: 2nd Gen Intel Xeon Scalable, Intel Xeon Scalable Сокет процессора: Dual Socket P (LGA 3647) TDP процессора: 205 W Depth: 23.5" Environmental Spec: Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) Форм-фактор: Blade Graphics: Aspeed AST2500 BMC Height: 9.75" Hot Swap: 2 Hot-Plug 2.5" NVMe, 3 Hot-plug 2.5" SAS3/SATA3 drive bays Отсеки горячей замены: 2 Hot-Plug 2.5" NVMe, 3 Hot-plug 2.5" SAS3/SATA3 Ipmi: Support for Intelligent Platform Management Interface (IPMI) v.2.0 via Chassis Management Module (CMM) Leds: Power LED UID / KVM LED Network Activity LED Fault LED Макс. ядер на процессор: 28 Макс. объем памяти: 768 GB Memory Capacity: 24 DIMM slots Up to 768GB VLP ECC DDR4-2933MHz RDIMM Слоты памяти: 24 Скорость памяти: 2933/2666/2400 MHz Тип памяти: ECC DDR4 VLP RDIMM Сетевой контроллер: Dual 10G LAN with Intel X722 Network Controllers: Dual 10G LAN with Intel® X722 Влажность хранения: 5 ~ 95 % Температура хранения: -40 ~ 60 °C Note: ‡ BIOS version 3.0a or above is required to support 2nd Gen. Intel® Xeon® Scalable processors Рабочая влажность: 8 ~ 90 % Рабочая температура: 10 ~ 35 °C Уровни RAID: 0, 1, 5 Rohs: RoHS Compliant Sas: Broadcom 3108 SAS3 (12Gbps) controller; HW RAID 0, 1, 5 support; 2GB Cache Sbi 6429P C3N: Dual-Socket Blade SBI-6429P-C3N Контроллер хранения: Broadcom 3108 SAS3 (12Gbps) Tpm: 1 TPM Header Разъем TPM: 1 Type: 2933/2666/2400MHz ECC DDR4 VLP RDIMM Weight: 12.6 lbs (5.71 kg) Width: 1.2"

Available Colors	Black
Bios Features	Plug and Play (PnP) PCI 2.2 ACPI up to 3.0 USB Keyboard support
Bios Type	128Mb SPI Flash EEPROM with AMI® BIOS
Buttons	Power On/Off button
Размер кэша	2 GB
Chipset	Intel® C622 chipset
Цвет	Black
Cores	Up to 28 Cores
Cpu	Dual Socket P (LGA 3647) 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors ‡ , 3 UPI up to 10.4GT/s Support CPU TDP up to 205W
Серия процессора	2nd Gen Intel Xeon Scalable, Intel Xeon Scalable
Сокет процессора	Dual Socket P (LGA 3647)
TDP процессора	205 W
Depth	23.5"
Environmental Spec	Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)
Форм-фактор	Blade
Graphics	Aspeed AST2500 BMC
Height	9.75"
Hot Swap	2 Hot-Plug 2.5" NVMe, 3 Hot-plug 2.5" SAS3/SATA3 drive bays
Отсеки горячей замены	2 Hot-Plug 2.5" NVMe, 3 Hot-plug 2.5" SAS3/SATA3
Ipmi	Support for Intelligent Platform Management Interface (IPMI) v.2.0 via Chassis Management Module (CMM)
Leds	Power LED UID / KVM LED Network Activity LED Fault LED
Макс. ядер на процессор	28
Макс. объем памяти	768 GB
Memory Capacity	24 DIMM slots Up to 768GB VLP ECC DDR4-2933MHz RDIMM
Слоты памяти	24
Скорость памяти	2933/2666/2400 MHz
Тип памяти	ECC DDR4 VLP RDIMM
Сетевой контроллер	Dual 10G LAN with Intel X722
Network Controllers	Dual 10G LAN with Intel® X722
Влажность хранения	5 ~ 95 %
Температура хранения	-40 ~ 60 °C
Note	‡ BIOS version 3.0a or above is required to support 2nd Gen. Intel® Xeon® Scalable processors
Рабочая влажность	8 ~ 90 %
Рабочая температура	10 ~ 35 °C
Уровни RAID	0, 1, 5
Rohs	RoHS Compliant
Sas	Broadcom 3108 SAS3 (12Gbps) controller; HW RAID 0, 1, 5 support; 2GB Cache
Sbi 6429P C3N	Dual-Socket Blade SBI-6429P-C3N
Контроллер хранения	Broadcom 3108 SAS3 (12Gbps)
Tpm	1 TPM Header
Разъем TPM	1
Type	2933/2666/2400MHz ECC DDR4 VLP RDIMM
Weight	12.6 lbs (5.71 kg)
Width	1.2"

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