Single-Socket Blade SBI-6419P-T3N

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Условия и положения
30-дневная гарантия возврата денежных средств
Доставка: 2–3 рабочих дня

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Новый Срок поставки: 21 дн.

Характеристики

Available Colors: Metallic Silver w/ Black Hard Drive Bays Bios Features: Plug and Play (PnP) PCI 2.2 ACPI up to 3.0 USB Keyboard support Bios Type: 128Mb SPI Flash EEPROM with AMI® BIOS Buttons: Power On/Off button KVM button Chipset: Intel® C622 chipset Connector: SUV (Serial/USB/Video) & KVM Connector Cores: Up to 28 Cores Cpu: Single Socket P (LGA 3647) 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors ‡ Support CPU TDP up to 205W Depth: 23.5" Environmental Spec: Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) Graphics: Aspeed AST2500 BMC Height: 9.75" Hot Swap: 3 Hot-Plug 2.5" NVMe or 3 Hot-plug 2.5" SATA3 drive bays Ipmi: Support for Intelligent Platform Management Interface (IPMI) v.2.0 via Chassis Management Module (CMM) Leds: Power LED UID / KVM LED Network Activity LED Fault LED Memory Capacity: 12 DIMM slots Up to 384GB VLP ECC DDR4-2933MHz RDIMM Network Controllers: Dual 10G LAN with Intel® X722 Note: ‡ BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R) Rohs: RoHS Compliant Sata: SATA3 (6Gbps) via Intel C622 RAID 0, 1, 5 Sbi 6419P T3N: Single-Socket Blade SBI-6419P-T3N Tpm: 1 TPM Header Type: 2933/2666/2400MHz ECC DDR4 VLP RDIMM Weight: 10.5 lbs (4.8 kg) Width: 1.2"

Available Colors	Metallic Silver w/ Black Hard Drive Bays
Bios Features	Plug and Play (PnP) PCI 2.2 ACPI up to 3.0 USB Keyboard support
Bios Type	128Mb SPI Flash EEPROM with AMI® BIOS
Buttons	Power On/Off button KVM button
Chipset	Intel® C622 chipset
Connector	SUV (Serial/USB/Video) & KVM Connector
Cores	Up to 28 Cores
Cpu	Single Socket P (LGA 3647) 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors ‡ Support CPU TDP up to 205W
Depth	23.5"
Environmental Spec	Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)
Graphics	Aspeed AST2500 BMC
Height	9.75"
Hot Swap	3 Hot-Plug 2.5" NVMe or 3 Hot-plug 2.5" SATA3 drive bays
Ipmi	Support for Intelligent Platform Management Interface (IPMI) v.2.0 via Chassis Management Module (CMM)
Leds	Power LED UID / KVM LED Network Activity LED Fault LED
Memory Capacity	12 DIMM slots Up to 384GB VLP ECC DDR4-2933MHz RDIMM
Network Controllers	Dual 10G LAN with Intel® X722
Note	‡ BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
Rohs	RoHS Compliant
Sata	SATA3 (6Gbps) via Intel C622 RAID 0, 1, 5
Sbi 6419P T3N	Single-Socket Blade SBI-6419P-T3N
Tpm	1 TPM Header
Type	2933/2666/2400MHz ECC DDR4 VLP RDIMM
Weight	10.5 lbs (4.8 kg)
Width	1.2"

Single-Socket Blade SBI-6419P-T3N

Характеристики

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