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FusionServer 2258H V8

FusionServer 2258H V8 Server XFUSION INTERNATIONAL PTE. LTD. No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of XFUSION INTERNATIONAL PTE. LTD. Trademarks and Permissions and other xFusion trademarks are trademarks of XFUSION INTERNATIONAL PTE. LTD. All other trademarks and trade names mentioned in this document are the property of their respective The purchased products, services and features are stipulated by the contract made between xFusion and the customer. All or part of the products, services and features described in this document may not be within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information, and recommendations in this document are provided "AS IS" without warranties, guarantees or representations of any kind, either express or implied. The information in this document is subject to change without notice. Every effort has been made in the preparation of this document to ensure accuracy of the contents, but all statements, information, and recommendations in this document do not constitute a warranty of any kind, express or implied. XFUSION INTERNATIONAL PTE. LTD. Website: https://www.xfusion.com Issue 03 (2026-01-06) Copyright © XFUSION INTERNATIONAL PTE. LTD. i FusionServer 2258H V8 Server Technical White Paper About This Document This document describes the appearance, features, performance parameters, and hardware and software compatibility of the server, so that users can have an in-depth and detailed understanding of it. This document is intended for pre-sales engineers. The symbols that may be found in this document are defined as follows: Indicates a hazard with a high level of risk which, if not avoided, could result in death or serious injury. Indicates a hazard with a medium risk which, if not avoided, could result in death or serious injury. Indicates a low-level hazard which, if not avoided, could result in minor or moderate injury. Indicates a potentially hazardous situation which, if not avoided, could result in device damage, data loss, device performance degradation, or other unpredictable results. NOTICE is used to address practices not related to Supplements the important information in the main text. NOTE is used to address information not related to personal injury, equipment damage, and environment Issue 03 (2026-01-06) Copyright © XFUSION INTERNATIONAL PTE. LTD. ii FusionServer 2258H V8 Server Technical White Paper Contents About This Document.........................................................................................................ii 1 Overview...........................................................................................................................1 2 Features............................................................................................................................2 3 Physical Structure...........................................................................................................5 4 Logic Structure................................................................................................................7 5 Hardware Description......................................................................................................8 5.1 Front Panel..................................................................................................................................................8 5.1.1 Appearance...............................................................................................................................................8 5.1.2 Indicators and Buttons..............................................................................................................................9 5.1.3 Ports........................................................................................................................................................13 5.2 Rear Panel.................................................................................................................................................15 5.2.1 Appearance.............................................................................................................................................16 5.2.2 Indicators and Buttons............................................................................................................................17 5.2.3 Ports........................................................................................................................................................19 5.3 Processors.................................................................................................................................................22 5.4 Memory......................................................................................................................................................23 5.4.1 DDR5 Memory.....................................................
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Условия и положения
30-дневная гарантия возврата денежных средств
Доставка: 2–3 рабочих дня
Новый Срок поставки: 21 дн.

Характеристики

Acoustic Noise: The declared A-weighted sound power levels (LWAd) and declared average bystander position A-weighted sound pressure levels (LpAm) listed are measured at 23ºC (73.4ºF) in accordance with ISO 7779 (ECMA 74) and declared in accordance with ISO Air Volume: ≥ 96 CFM Corrosive Airborne Contaminants: Maximum growth rate of the corrosion product thickness: ● Copper corrosion rate test: 300 Å/month (meeting level G1 requirements of the ANSI/ISA-71.04-2013 standard on gaseous corrosion) ● Silver corrosion rate test: 200 Å/month Глубина: 798 mm Dimensions H X W X D: ● Chassis with 3.5" drives: 86.1 mm × 447 mm × 798 mm (3.39 in. x 17.60 in. x 31.42 in.) ● Chassis with 2.5" drives: 86.1 mm × 447 mm × 798 mm (3.39 in. x 17.60 in. x 31.42 in.) Figure 6-1 Physical dimensions (example: a chassis with 3.5" d server: 2U 2-socket rack server Порты USB на передней панели: 2 Graphics Card: Supports an integrated graphics chip (SM750) on the mainboard, providing 32 MB video memory. The maximum resolution at 60 Hz with 16M colors is 1920 x 1200 pixels. NOTE The integrated graphics card can provide the maximum display resolution Графический чип: SM750 Высота: 86.1 mm I O Expansion: Supports a maximum of ten tandard PCIe expansion slots, four of which are HHHL. Supports a maximum of eight FH standard PCIe expansion slots. ● Two FlexIO expansion slots dedicated for OCP 3.0 NICs and ten standard PCIe expansion slots. For Installation Space: ● Requirements for cabinet installation: Use a standard cabinet that complies with the International Electrotechnical Commission 297 (IEC 297) standard. – Cabinet width: 482.6 mm (19.00 in.) – Cabinet depth ≥ 1000 mm (39.37 in.) ● Requireme Макс. частота памяти: 6400 MT/s Макс. высота эксплуатации: 3050 m Макс. разрешение: 1920x1200 px Макс. вес: 32 kg Memory: The server supports 24 DIMM slots. ● Up to 24 DDR5 DIMMs. – Supports RDIMM. – Max. 6400 MT/s memory speed – The DDR5 memory modules of different types and specifications (capacity, bit width, rank, and height) cannot be used together. – A s Слоты памяти: 24 Тип памяти: DDR5 RDIMM Network: The OCP 3.0 NICs provide network expansion capabilities. A variety of OCP 3.0 NICs. For details, see "Search Parts" in the compatibility list on the technical support website. Тип сетевого интерфейса: OCP 3.0 Operating Altitude: ≤ 3050 m (10006.56 ft) ● When the configuration complies with ASHRAE Class A1 and A2, and the altitude is above 900 m (2952.76 ft), the operating temperature decreases by 1ºC (1.8 ºF) for every increase of 300 m (984.25 ft). ● When the conf | 006.56 ft). Влажность при работе (макс.): 90 % Влажность при работе (мин.): 8 % Particle Contaminant: ● The equipment room environment meets the requirements of ISO 14664-1 Class 8. ● There is no explosive, conductive, magnetic, or corrosive dust in the equipment room. NOTE It is recommended that the particulate pollution in the equipment r Слоты PCIe: 10 Ports: A variety of ports. ● Ports on the front panel: – One USB Type-C iBMC direct connect management port – Two USB 3.0 ports ● Ports on the rear panel: – Two USB 3.0 ports – One DB15 VGA port – One RJ45 serial port – One RJ45 management network Power Consumption: The power consumption parameters vary with hardware configurations (including the configurations complying with EU ErP). For details, see Power Calculator on the technical support website. Порты USB на задней панели: 2 Relative Humidity Rh Non Condensing: ● Operating humidity: 8% to 90% ● Storage humidity (within three months): 8% to 85% ● Storage humidity (within six months): 8% to 80% ● Storage humidity (within one year): 20% to 75% ● Maximum humidity change rate: 20% /hour ● Operational c Security Feature: ● Power-on password ● Administrator password ● TPM (for China and outside China) /TCM (only for China) ● Secure boot ● Front bezel (optional) ● Chassis cover intrusion detection System Management: ● UEFI ● iBMC ● NC-SI ● Integration with third-party management systems Порт VGA: 1 Видеопамять: 32 MB Weight In Full Configuration: ● Net weight: – Maximum weight for a server with a 8 x 2.5" pass- through chassis: 22.5 kg (49.6 lb) – Maximum weight for a server with a 8 x 3.5" pass- through chassis: 32 kg (70.55 lb) – Maximum weight for a server with a 16 x 2.5" pass- Ширина: 447 mm
Acoustic Noise The declared A-weighted sound power levels (LWAd) and declared average bystander position A-weighted sound pressure levels (LpAm) listed are measured at 23ºC (73.4ºF) in accordance with ISO 7779 (ECMA 74) and declared in accordance with ISO
Air Volume ≥ 96 CFM
Corrosive Airborne Contaminants Maximum growth rate of the corrosion product thickness: ● Copper corrosion rate test: 300 Å/month (meeting level G1 requirements of the ANSI/ISA-71.04-2013 standard on gaseous corrosion) ● Silver corrosion rate test: 200 Å/month
Глубина 798 mm
Dimensions H X W X D ● Chassis with 3.5" drives: 86.1 mm × 447 mm × 798 mm (3.39 in. x 17.60 in. x 31.42 in.) ● Chassis with 2.5" drives: 86.1 mm × 447 mm × 798 mm (3.39 in. x 17.60 in. x 31.42 in.) Figure 6-1 Physical dimensions (example: a chassis with 3.5" d
Форм-фактор 2U 2-socket rack server
Порты USB на передней панели 2
Graphics Card Supports an integrated graphics chip (SM750) on the mainboard, providing 32 MB video memory. The maximum resolution at 60 Hz with 16M colors is 1920 x 1200 pixels. NOTE The integrated graphics card can provide the maximum display resolution
Графический чип SM750
Высота 86.1 mm
I O Expansion Supports a maximum of ten tandard PCIe expansion slots, four of which are HHHL. Supports a maximum of eight FH standard PCIe expansion slots. ● Two FlexIO expansion slots dedicated for OCP 3.0 NICs and ten standard PCIe expansion slots. For
Installation Space ● Requirements for cabinet installation: Use a standard cabinet that complies with the International Electrotechnical Commission 297 (IEC 297) standard. – Cabinet width: 482.6 mm (19.00 in.) – Cabinet depth ≥ 1000 mm (39.37 in.) ● Requireme
Макс. частота памяти 6400 MT/s
Макс. высота эксплуатации 3050 m
Макс. разрешение 1920x1200 px
Макс. вес 32 kg
Memory The server supports 24 DIMM slots. ● Up to 24 DDR5 DIMMs. – Supports RDIMM. – Max. 6400 MT/s memory speed – The DDR5 memory modules of different types and specifications (capacity, bit width, rank, and height) cannot be used together. – A s
Слоты памяти 24
Тип памяти DDR5 RDIMM
Network The OCP 3.0 NICs provide network expansion capabilities. A variety of OCP 3.0 NICs. For details, see "Search Parts" in the compatibility list on the technical support website.
Тип сетевого интерфейса OCP 3.0
Operating Altitude ≤ 3050 m (10006.56 ft) ● When the configuration complies with ASHRAE Class A1 and A2, and the altitude is above 900 m (2952.76 ft), the operating temperature decreases by 1ºC (1.8 ºF) for every increase of 300 m (984.25 ft). ● When the conf | 006.56 ft).
Влажность при работе (макс.) 90 %
Влажность при работе (мин.) 8 %
Particle Contaminant ● The equipment room environment meets the requirements of ISO 14664-1 Class 8. ● There is no explosive, conductive, magnetic, or corrosive dust in the equipment room. NOTE It is recommended that the particulate pollution in the equipment r
Слоты PCIe 10
Ports A variety of ports. ● Ports on the front panel: – One USB Type-C iBMC direct connect management port – Two USB 3.0 ports ● Ports on the rear panel: – Two USB 3.0 ports – One DB15 VGA port – One RJ45 serial port – One RJ45 management network
Power Consumption The power consumption parameters vary with hardware configurations (including the configurations complying with EU ErP). For details, see Power Calculator on the technical support website.
Порты USB на задней панели 2
Relative Humidity Rh Non Condensing ● Operating humidity: 8% to 90% ● Storage humidity (within three months): 8% to 85% ● Storage humidity (within six months): 8% to 80% ● Storage humidity (within one year): 20% to 75% ● Maximum humidity change rate: 20% /hour ● Operational c
Security Feature ● Power-on password ● Administrator password ● TPM (for China and outside China) /TCM (only for China) ● Secure boot ● Front bezel (optional) ● Chassis cover intrusion detection
System Management ● UEFI ● iBMC ● NC-SI ● Integration with third-party management systems
Порт VGA 1
Видеопамять 32 MB
Weight In Full Configuration ● Net weight: – Maximum weight for a server with a 8 x 2.5" pass- through chassis: 22.5 kg (49.6 lb) – Maximum weight for a server with a 8 x 3.5" pass- through chassis: 32 kg (70.55 lb) – Maximum weight for a server with a 16 x 2.5" pass-
Ширина 447 mm

[HUAWEI-HUAWEI-CPU-2-INTEL-XEON-SCALABLE-PROCESSORS] 2 Intel®Xeon®Scalable processors
Processor ·
[HPE-HPE-CPU-P02568B21] HPE DL360 Gen10 5215M Xeon-G Kit(P02568-B21)
Processor ·
[HPE-HPE-CPU-876089B21] HPE DL360 Gen10 6140M Xeon-G Kit(876089-B21)
Processor ·
[HPE-HPE-CPU-876091B21] HPE DL360 Gen10 6142M Xeon-G Kit(876091-B21)
Processor ·
[HPE-HPE-CPU-P02691B21] HPE DL360 Gen10 6238M Xeon-G Kit(P02691-B21)
Processor ·
[HPE-HPE-CPU-P02688B21] HPE DL360 Gen10 6240M Xeon-G Kit(P02688-B21)
Processor ·
[HPE-HPE-CPU-874452B21] HPE DL360 Gen10 8156 Xeon-P Kit(874452-B21)
Processor ·
[HPE-HPE-CPU-876095B21] HPE DL360 Gen10 8170M Xeon-P Kit(876095-B21)
Processor ·
[HPE-HPE-CPU-876097B21] HPE DL360 Gen10 8176M Xeon-P Kit(876097-B21)
Processor ·
[HPE-HPE-CPU-P02694B21] HPE DL360 Gen10 8260M Xeon-P Kit(P02694-B21)
Processor ·
[HPE-HPE-CPU-P02700B21] HPE DL360 Gen10 8276M Xeon-P Kit(P02700-B21)
Processor ·
[HPE-HPE-CPU-P02703B21] HPE DL360 Gen10 8280M Xeon-P Kit(P02703-B21)
Processor ·
[HPE-HPE-CPU-P02530B21] HPE DL380 Gen10 5215M Xeon-G Kit(P02530-B21)
Processor ·
[HPE-HPE-CPU-874762B21] HPE DL380 Gen10 6140M Xeon-G Kit(874762-B21)
Processor ·
[HPE-HPE-CPU-874760B21] HPE DL380 Gen10 6142M Xeon-G Kit(874760-B21)
Processor ·
[HPE-HPE-CPU-P02529B21] HPE DL380 Gen10 6238M Xeon-G Kit(P02529-B21)
Processor ·
[HPE-HPE-CPU-P02528B21] HPE DL380 Gen10 6240M Xeon-G Kit(P02528-B21)
Processor ·
[HPE-HPE-CPU-871616B21] HPE DL380 Gen10 8156 Xeon-P Kit(871616-B21)
Processor ·
[HPE-HPE-CPU-874758B21] HPE DL380 Gen10 8160M Xeon-P Kit(874758-B21)
Processor ·
[HPE-HPE-CPU-874756B21] HPE DL380 Gen10 8170M Xeon-P Kit(874756-B21)
Processor ·
[HPE-HPE-CPU-P02532B21] HPE DL380 Gen10 8260M Xeon-P Kit(P02532-B21)
Processor ·
[HPE-HPE-CPU-P02534B21] HPE DL380 Gen10 8276M Xeon-P Kit(P02534-B21)
Processor ·
[HPE-HPE-CPU-P02535B21] HPE DL380 Gen10 8280M Xeon-P Kit(P02535-B21)
Processor ·
[LEN-SBB7A97762] INTEL(R) XEON(R) GOLD EMERALD RAPIDS 6551C 32C 225W 2.6GHz CMCC
Processor ·
[LEN-SBB7A97761] INTEL(R) XEON(R) PLATINUM EMERALD RAPIDS 8551C 48C 385W 2.9GHz Processor CMCC
Processor ·
[LEN-SBB7A97759] INTEL(R) XEON(R) PLATINUM EMERALD RAPIDS 8566C 52C 385W 2.6GHz Processor CTCC
Processor ·
[LEN-SBB7A74444] INTEL(R) XEON(R) PLATINUM SAPPHIRE RAPIDS XCC E-5, 8457C 48C/2.6G/350W
Processor ·
[LEN-SBB7A78224] Intel Xeon 5423N 20C 145W 2.1GHz Processor
Processor ·
[LEN-SBB7A78225] Intel Xeon 5433N 20C 160W 2.3GHz Processor
Processor ·
[LEN-SBB7A64345] Intel Xeon Bronze 3408U 8C 125W 1.8GHz Processor
Processor ·
[LEN-SBB7A85032] Intel Xeon Bronze 3508U 8C 125W 2.1GHz Processor
Processor ·
[LEN-SBB7A72875] Intel Xeon CPU Max 9460 40C 350W 2.2GHz Processor
Processor ·
[LEN-SBB7A72876] Intel Xeon CPU Max 9462 32C 350W 2.7GHz Processor
Processor ·
[LEN-SBB7A72874] Intel Xeon CPU Max 9468 48C 350W 2.1GHz Processor
Processor ·
[LEN-SBB7A72873] Intel Xeon CPU Max 9470 52C 350W 2.0GHz Processor
Processor ·
[LEN-SBB7A72872] Intel Xeon CPU Max 9480 56C 350W 1.9GHz Processor
Processor ·
[LEN-SBB7A09943] Intel Xeon E-2104G 4+2C 65W 3.2GHz Processor
Processor ·
[LEN-SBB7A09942] Intel Xeon E-2124 4C 71W 3.3GHz Processor
Processor ·
[LEN-SBB7A09941] Intel Xeon E-2124G 4+2C 71W 3.4GHz Processor
Processor ·
[LEN-SBB7A09940] Intel Xeon E-2126G 6+2C 80W 3.3GHz Processor
Processor ·
[LEN-SBB7A53826] 128GB DDR5 4800MHz (4Rx4) 3DS RDIMM
Memory ·
[HPE-PRODUCT-HPE-BUNDLE-P60638-421-CPU-MEM-6-DF29FCD484D6] 2 Processors and 1024 GB Memory
Memory ·
[HPE-PRODUCT-HPE-BUNDLE-P35518-B21-CPU-MEM-7-A5FE23C34D80] 2 Processors and 128 GB Memory
Memory ·
[HPE-PRODUCT-HPE-BUNDLE-P50751-B21-CPU-MEM-7-A5FE23C34D80] 2 Processors and 128 GB Memory
Memory ·
[HPE-PRODUCT-HPE-BUNDLE-P56954-421-CPU-MEM-7-A5FE23C34D80] 2 Processors and 128 GB Memory
Memory ·
[HPE-PRODUCT-HPE-BUNDLE-P56958-421-CPU-MEM-10-4093C44361B4] 2 Processors and 1280 GB Memory
Memory ·
[HPE-PRODUCT-HPE-BUNDLE-P20249-B21-CPU-MEM-10-4093C44361B4] 2 Processors and 1280 GB Memory
Memory ·
[HPE-PRODUCT-HPE-BUNDLE-P55252-B21-CPU-MEM-8-866A9C3C5AEC] 2 Processors and 256 GB Memory
Memory ·
[HPE-PRODUCT-HPE-BUNDLE-P55246-B21-CPU-MEM-6-866A9C3C5AEC] 2 Processors and 256 GB Memory
Memory ·
[HPE-PRODUCT-HPE-BUNDLE-P20245-B21-CPU-MEM-8-866A9C3C5AEC] 2 Processors and 256 GB Memory
Memory ·
[HPE-PRODUCT-HPE-BUNDLE-P19560-421-CPU-MEM-8-648F010BA9BF] 2 Processors and 384 GB Memory
Memory ·
[HPE-PRODUCT-HPE-BUNDLE-P51931-421-CPU-MEM-5-55F291290623] 2 Processors and 512 GB Memory
Memory ·
[HPE-PRODUCT-HPE-BUNDLE-P52562-B21-CPU-MEM-4-6A99FB339650] 2 Processors and 64 GB Memory
Memory ·
[HPE-PRODUCT-HPE-BUNDLE-P19774-B21-CPU-MEM-7-6A99FB339650] 2 Processors and 64 GB Memory
Memory ·
[HPE-PRODUCT-HPE-BUNDLE-P20245-B21-CPU-MEM-6-6A99FB339650] 2 Processors and 64 GB Memory
Memory ·
[HPE-PRODUCT-HPE-BUNDLE-P55276-421-CPU-MEM-6-6A99FB339650] 2 Processors and 64 GB Memory
Memory ·
[HPE-PRODUCT-HPE-BUNDLE-P59549-421-CPU-MEM-9-4967EB9EB9DB] 2 Processors and 768 GB Memory
Memory ·
[HPE-PRODUCT-HPE-BUNDLE-P56955-421-CPU-MEM-9-4967EB9EB9DB] 2 Processors and 768 GB Memory
Memory ·
[HPE-PRODUCT-HPE-BUNDLE-P40638-B21-CPU-MEM-9-4967EB9EB9DB] 2 Processors and 768 GB Memory
Memory ·
[LEN-SBB7B00900] 32GB DDR5 5600MHz (2RX8) RDIMM GC-A
Memory ·

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multi
[LEN-SBB7A53826] 128GB DDR5 4800MHz (4Rx4) 3DS RDIMM LEN-SBB7A53826
[HPE-PRODUCT-HPE-BUNDLE-P60638-421-CPU-MEM-6-DF29FCD484D6] 2 Processors and 1024 GB Memory HPE-PRODUCT-HPE-BUNDLE-P60638-421-CPU-MEM-6-DF29FCD484D6
[HPE-PRODUCT-HPE-BUNDLE-P35518-B21-CPU-MEM-7-A5FE23C34D80] 2 Processors and 128 GB Memory HPE-PRODUCT-HPE-BUNDLE-P35518-B21-CPU-MEM-7-A5FE23C34D80
[HPE-PRODUCT-HPE-BUNDLE-P50751-B21-CPU-MEM-7-A5FE23C34D80] 2 Processors and 128 GB Memory HPE-PRODUCT-HPE-BUNDLE-P50751-B21-CPU-MEM-7-A5FE23C34D80
[HPE-PRODUCT-HPE-BUNDLE-P56954-421-CPU-MEM-7-A5FE23C34D80] 2 Processors and 128 GB Memory HPE-PRODUCT-HPE-BUNDLE-P56954-421-CPU-MEM-7-A5FE23C34D80
[HPE-PRODUCT-HPE-BUNDLE-P56958-421-CPU-MEM-10-4093C44361B4] 2 Processors and 1280 GB Memory HPE-PRODUCT-HPE-BUNDLE-P56958-421-CPU-MEM-10-4093C44361B4
[HPE-PRODUCT-HPE-BUNDLE-P20249-B21-CPU-MEM-10-4093C44361B4] 2 Processors and 1280 GB Memory HPE-PRODUCT-HPE-BUNDLE-P20249-B21-CPU-MEM-10-4093C44361B4
[HPE-PRODUCT-HPE-BUNDLE-P55252-B21-CPU-MEM-8-866A9C3C5AEC] 2 Processors and 256 GB Memory HPE-PRODUCT-HPE-BUNDLE-P55252-B21-CPU-MEM-8-866A9C3C5AEC
[HPE-PRODUCT-HPE-BUNDLE-P55246-B21-CPU-MEM-6-866A9C3C5AEC] 2 Processors and 256 GB Memory HPE-PRODUCT-HPE-BUNDLE-P55246-B21-CPU-MEM-6-866A9C3C5AEC
[HPE-PRODUCT-HPE-BUNDLE-P20245-B21-CPU-MEM-8-866A9C3C5AEC] 2 Processors and 256 GB Memory HPE-PRODUCT-HPE-BUNDLE-P20245-B21-CPU-MEM-8-866A9C3C5AEC
[HPE-PRODUCT-HPE-BUNDLE-P19560-421-CPU-MEM-8-648F010BA9BF] 2 Processors and 384 GB Memory HPE-PRODUCT-HPE-BUNDLE-P19560-421-CPU-MEM-8-648F010BA9BF
[HPE-PRODUCT-HPE-BUNDLE-P51931-421-CPU-MEM-5-55F291290623] 2 Processors and 512 GB Memory HPE-PRODUCT-HPE-BUNDLE-P51931-421-CPU-MEM-5-55F291290623
[HPE-PRODUCT-HPE-BUNDLE-P52562-B21-CPU-MEM-4-6A99FB339650] 2 Processors and 64 GB Memory HPE-PRODUCT-HPE-BUNDLE-P52562-B21-CPU-MEM-4-6A99FB339650
[HPE-PRODUCT-HPE-BUNDLE-P19774-B21-CPU-MEM-7-6A99FB339650] 2 Processors and 64 GB Memory HPE-PRODUCT-HPE-BUNDLE-P19774-B21-CPU-MEM-7-6A99FB339650
[HPE-PRODUCT-HPE-BUNDLE-P20245-B21-CPU-MEM-6-6A99FB339650] 2 Processors and 64 GB Memory HPE-PRODUCT-HPE-BUNDLE-P20245-B21-CPU-MEM-6-6A99FB339650
[HPE-PRODUCT-HPE-BUNDLE-P55276-421-CPU-MEM-6-6A99FB339650] 2 Processors and 64 GB Memory HPE-PRODUCT-HPE-BUNDLE-P55276-421-CPU-MEM-6-6A99FB339650
[HPE-PRODUCT-HPE-BUNDLE-P59549-421-CPU-MEM-9-4967EB9EB9DB] 2 Processors and 768 GB Memory HPE-PRODUCT-HPE-BUNDLE-P59549-421-CPU-MEM-9-4967EB9EB9DB
[HPE-PRODUCT-HPE-BUNDLE-P56955-421-CPU-MEM-9-4967EB9EB9DB] 2 Processors and 768 GB Memory HPE-PRODUCT-HPE-BUNDLE-P56955-421-CPU-MEM-9-4967EB9EB9DB
[HPE-PRODUCT-HPE-BUNDLE-P40638-B21-CPU-MEM-9-4967EB9EB9DB] 2 Processors and 768 GB Memory HPE-PRODUCT-HPE-BUNDLE-P40638-B21-CPU-MEM-9-4967EB9EB9DB
[LEN-SBB7B00900] 32GB DDR5 5600MHz (2RX8) RDIMM GC-A LEN-SBB7B00900
[HPE-PRODUCT-HPE-BUNDLE-P40459-B21-CPU-MEM-2-89AE697F436C] 4 Processors and 1536 GB Memory HPE-PRODUCT-HPE-BUNDLE-P40459-B21-CPU-MEM-2-89AE697F436C
[HPE-PRODUCT-HPE-BUNDLE-P40456-B21-CPU-MEM-2-E6BDAB7E36F8] 4 Processors and 512 GB Memory HPE-PRODUCT-HPE-BUNDLE-P40456-B21-CPU-MEM-2-E6BDAB7E36F8
[HUAWEI-HUAWEI-MEMORY-8-DDR4-DIMMS-FOR-EACH-2-SOCKET-COMPUTE-N] 8 DDR4 DIMMs for each 2-socket compute node HUAWEI-HUAWEI-MEMORY-8-DDR4-DIMMS-FOR-EACH-2-SOCKET-COMPUTE-N
[P00924-B21] HPE 32GB (1x32GB) Dual Rank x4 DDR4-2933 CAS-21-21-21 Registered Smart Memory Kit P00924-B21
[HPE-HPE-MEMORY-835810B21] Intel Optane 512GB persistent memory 100 Series for HPE(835810-B21) HPE-HPE-MEMORY-835810B21
[LEN-SBB7A12439] ThinkSystem 128GB TruDDR4 3200MHz (1.2V) Intel Optane Persistent Memory LEN-SBB7A12439
[LEN-SBB7A12427] ThinkSystem 16GB TruDDR4 Performance+ 2933MHz (2Rx8 1.2V) RDIMM LEN-SBB7A12427
[LEN-SBB7A30752] ThinkSystem 32GB TruDDR4 2933MHz (2Rx4 1.2V) RDIMM (A1 Sourced - MTA36ASF4G72PZ-2G9E2) LEN-SBB7A30752
[LEN-SBB7A87393] ThinkSystem 32GB TruDDR5 6400MHz (2Rx8) RDIMM-A LEN-SBB7A87393
[LEN-SBB7A52786] ThinkSystem 64GB TruDDR5 4800MHz (2Rx4) 9x4 RDIMM-A LEN-SBB7A52786
Internal Storage
0
multi
[MCP-220-00160-0N] Dual 2.5" NVMe Drive BKT: 743, 745, 502, 503, 510, 512, 515 MCP-220-00160-0N
[CBL-SAST-0819] OCuLink v 1.0,INT,PCIe NVMe SSD, 65CM,34AWG,RoHS/REACH CBL-SAST-0819
[CBL-SAST-0847] OCuLink v.1.0 ,INT,PCIe NVMe SSD, 76CM, 11D38F27D,34AWG,RoHS CBL-SAST-0847
[MCP-220-00138-0B] Tool-less black hot-swap 3.5-to-2.5 converter NVMe drive tray (Orange tab) MCP-220-00138-0B
[MCP-220-00140-0B] Black gen 8 hot-swap 3.5-to-2.5 Tool-less HDD tray, orange tab MCP-220-00140-0B
[MCP-220-00147-0B] Black gen-3 hot-swap 2.5"; Tool-less HDD tray (clip design) MCP-220-00147-0B
[MCP-220-00043-0N] Black hotswap gen 4 3.5 to 2.5 HDD tray MCP-220-00043-0N
[MCP-240-00127-0N] CacheVault for Broadcom 3108; SuperCap mounting bracket for 2.5" HDD location; Black Hot-swap Gen-4 2.5" to 3.5" HDD tray MCP-240-00127-0N
[MCP-220-00044-0N] Dual 2.5" fixed HDD bracket for SC502, 503, 510, 512, 515U MCP-220-00044-0N
[CBL-SAST-0822-1] (NVMe 0-1) SLIMLINE x8 (RE) to 2x Oculink x4, 63/63CM,85 OHM CBL-SAST-0822-1
[CBL-SAST-0857-1] (NVMe 10-11) SLIMLINE SAS x8 (LS) to 2x MINI SAS HD x4,INT, 80CM,32AWG CBL-SAST-0857-1
[CBL-SAST-1154-85] (NVMe 2-3) SLIMLINE x8 (RE) to 2x Oculink x4,INT, 54CM, 85 OHM CBL-SAST-1154-85
[CBL-SAST-1149-85] (NVMe 4.5) SLIMLINE SAS x8 (RE) to 2x Oculink x4,INT, 49CM, 85 OHM CBL-SAST-1149-85
[CBL-SAST-0821-1] (NVMe 6-7) SLIMLINE x8 (LE) to 2x Oculink x4, 46/50CM,85 OHM CBL-SAST-0821-1
[CBL-SAST-0856-1] (NVMe 8-9) SLIMLINE SAS x8 (LS) to 2x MINI SAS HD x4,INT, 74CM,32AWG CBL-SAST-0856-1
[BPN-SAS3-116A-N10] 10-port 1U SAS3 12Gbps Hybrid backplane, support up to 10x 2.5-inch NVMe storage devices, 4 of them are SAS3/SATA3 drives compatible. BPN-SAS3-116A-N10
[BPN-SAS3-116A-N2] 10-port 1U SAS3 12Gbps Hybrid backplane, support up to 8x 2.5-inch SAS3/SATA3 HDD/SSD and 2x SAS3/SATA3/NVMe Storage Devices BPN-SAS3-116A-N2
[HUAWEI-HUAWEI-STORAGE-12-NVME-SSDS] 12 NVMe SSDs HUAWEI-HUAWEI-STORAGE-12-NVME-SSDS
[HUAWEI-HUAWEI-STORAGE-12-X-2-5-IN-NVME-SSDS-AND-2-X-2-5-IN-SAS] 12 x 2.5-in. NVMe SSDs and 2 x 2.5-in. SAS/SATA HDDs HUAWEI-HUAWEI-STORAGE-12-X-2-5-IN-NVME-SSDS-AND-2-X-2-5-IN-SAS
[BPN-SAS3-826A-N4] 12-port 2U SAS3 12Gbps hybrid backplane, support up to 8x 3.5-inch SAS3/SATA3 HDD/SSD and 4x SAS3/SATA3/NVMe Storage Devices BPN-SAS3-826A-N4
[BPN-SAS3-826EL1-N4] 12-port 2U SAS3 12Gbps single-expander backplane, support up to 8x 3.5-inch SAS3/SATA3 HDD/SSD and 4x NVMe/SAS3/SATA3 storage devices BPN-SAS3-826EL1-N4
[HUAWEI-HUAWEI-RAID-14-M-2-SSDS-SUPPORTS-RAID-0-1-10-5] 14 M.2 SSDs; supports RAID 0, 1, 10, 5, HUAWEI-HUAWEI-RAID-14-M-2-SSDS-SUPPORTS-RAID-0-1-10-5
[HUAWEI-HUAWEI-STORAGE-16-X-2-5-NVME-SSDS] 16 x 2.5" NVMe SSDs HUAWEI-HUAWEI-STORAGE-16-X-2-5-NVME-SSDS
[BPN-SAS3-213A-N8] 16-port 2U SAS3 12Gbps hybrid backplane, support up to 8x 2.5-inch SAS3/SATA3 HDD/SSD and 8x SAS3/SATA3/NVMe Storage Devices BPN-SAS3-213A-N8
[LEN-SBB7A89731] 16x CXL E3.S (2T) Chassis LEN-SBB7A89731
[LEN-SBB7A88393] 1T E3.S Solidigm PS1010 3.84TB Read Intensive NVMe PCIe 5.0 Hot Swap SSD LEN-SBB7A88393
[LEN-SBB7A88394] 1T E3.S Solidigm PS1030 3.2TB Mixed Use NVMe PCIe 5.0 Hot Swap SSD LEN-SBB7A88394
[LEN-SBB7A88403] 1T E3.S Unionmemory UH812a 1.92TB Read Intensive NVMe PCIe 5.0 Hot Swap SSD LEN-SBB7A88403
[LEN-SBB7A88404] 1T E3.S Unionmemory UH812a 3.84TB Read Intensive NVMe PCIe 5.0 Hot Swap SSD LEN-SBB7A88404
[LEN-SBB7A88405] 1T E3.S Unionmemory UH812a 7.68TB Read Intensive NVMe PCIe 5.0 Hot Swap SSD LEN-SBB7A88405
[LEN-SBB7A88406] 1T E3.S Unionmemory UH832a 1.6TB Mixed Use NVMe PCIe 5.0 Hot Swap SSD LEN-SBB7A88406
[LEN-SBB7A88407] 1T E3.S Unionmemory UH832a 3.2TB Mixed Use NVMe PCIe 5.0 Hot Swap SSD LEN-SBB7A88407
[LEN-SBB7A88408] 1T E3.S Unionmemory UH832a 6.4TB Mixed Use NVMe PCIe 5.0 Hot Swap SSD LEN-SBB7A88408
[BPN-SAS3-118GH-N2] 1U 4-Port Hybrid Backplane Supports 2 x 2.5" SAS3/SATA3 HDD/SSD and 2 x 2.5" SAS3/SATA3/NVMe Storage Device for GPU Platform,HF,RoHS BPN-SAS3-118GH-N2
[BPN-NVME4-HE211N-S6] 1U 6-Slot BPN Supports 6 x SAS3/SATA3/NVMe4 Storage Device,HF,RoHS BPN-NVME4-HE211N-S6
[BPN-SAS3-119A-N12] 1U Hybrid BPN for 12x2.5"; SAS3/SATA3/NVMe Storage Devices BPN-SAS3-119A-N12
[RSC-GN2-66] 1U Passive LHS GPU Riser Card with two NVMe ports and two PC RSC-GN2-66
[RSC-UMR-8] 1U Ultra RHS Riser Card with 1 PCIE/SATA Hybrid M.2 &1 PCIE X8 RSC-UMR-8
[FST-SCRW-0074L] 1U Ultra RHS Riser Card with 1 PCIE/SATA Hybrid M.2 &1 PCIE X8 (FST-SCRW-0074L) FST-SCRW-0074L
[MCP-120-82924-0N] 1U Ultra RHS Riser Card with 1 PCIE/SATA Hybrid M.2 &1 PCIE X8 (MCP-120-82924-0N) MCP-120-82924-0N
[MCP-310-21902-0N] 1U Ultra RHS Riser Card with 1 PCIE/SATA Hybrid M.2 &1 PCIE X8 (MCP-310-21902-0N) MCP-310-21902-0N
[AOC-URN2-I4GXS-P] 1U Ultra Riser 2-port 10GbE SFP+ Intel X710-AM2, and 2-port GbE RJ45, Intel i350-AM2. 1 PCI-E 3.0 x8 (internal) 2 NVMe ports AOC-URN2-I4GXS-P
[AOC-URN2-I2XS] 1U Ultra Riser based on Intel 82599ES controller with 2 10Gb SFP+ ports, 2 NVMe ports, and 1 internal PCI-E x8 3.0 slot AOC-URN2-I2XS
[AOC-URN2-I2XT] 1U Ultra Riser based on Intel X540 controller with 2 10Gbase-T ports, 2 NVMe ports, and 1 internal PCI-E x8 3.0 slot AOC-URN2-I2XT
[AOC-URN2-I4XT] 1U Ultra Riser based on Intel X540 controller with 4 10Gbase-T ports, 2 NVMe ports, and 1 internal PCI-E x8 3.0 slot AOC-URN2-I4XT
[BPN-SAS3-F424-A2N2A] 2-Port Hybrid Backplane support 2 x SAS3/SATA3/NVMe Storage Devices BPN-SAS3-F424-A2N2A
[LEN-SBB7A65478] 2.5 Kioxia CD7 1.92T Entry NVMe Hot Swap SSD L1 LEN-SBB7A65478
[LEN-SBB7A88183] 2.5 Kioxia CD7 1.92T KCD71RUG1T92 NVMe SSD-YC1 LEN-SBB7A88183
[LEN-SBB7A88184] 2.5 Kioxia CD7 3.2T KCD71VUG3T20 NVMe SSD-YC1 LEN-SBB7A88184
[LEN-SBB7A65480] 2.5 Kioxia CD7 3.84T Entry NVMe Hot Swap SSD L1 LEN-SBB7A65480
[LEN-SBB7A88185] 2.5 Kioxia CD7 7.68T KCD71RUG7T68 NVMe SSD-YC1 LEN-SBB7A88185
[LEN-SBB7A30215] 2.5 Memblaze D520 NVMe SSD U.2 PCIe 3.0x4 3.84TB LEN-SBB7A30215
[LEN-SBB7A53842] 2.5 P5620 3DWPD U.2 PCIe 4.0 1.6TB NVMe SSD LEN-SBB7A53842
[LEN-SBB7A53843] 2.5 P5620 3DWPD U.2 PCIe 4.0 3.2TB NVMe SSD LEN-SBB7A53843
[LEN-SBB7A74888] 2.5 U.2 DERA D7436 1.92TB Read Intensive NVMe PCIe 4.0 Hot Swap SSD LEN-SBB7A74888
[LEN-SBB7A73326] 2.5 U.2 DERA D7436 1.92TB Read Intensive NVMe PCIe 4.0 Hot Swap SSD AVAP -YC1 LEN-SBB7A73326
[LEN-SBB7A74889] 2.5 U.2 DERA D7436 3.84TB Read Intensive NVMe PCIe 4.0 Hot Swap SSD LEN-SBB7A74889
[LEN-SBB7A74890] 2.5 U.2 DERA D7436 7.68TB Read Intensive NVMe PCIe 4.0 Hot Swap SSD LEN-SBB7A74890
[LEN-SBB7A73328] 2.5 U.2 DERA D7436 7.68TB Read Intensive NVMe PCIe 4.0 Hot Swap SSD AVAP -YC1 LEN-SBB7A73328
[LEN-SBB7A74891] 2.5 U.2 DERA D7456 1.6TB Mixed Use NVMe PCIe 4.0 Hot Swap SSD LEN-SBB7A74891
Power Supply
0
Expansion Cards
0
Networking
0
multi