Новый
Срок поставки: 21 дн.
Характеристики
Available Colors: Black
Bios Features: Plug and Play (PnP) PCI 2.2 ACPI up to 3.0 USB Keyboard support
Bios Type: 128Mb SPI Flash EEPROM with AMI® BIOS
Buttons: Power On/Off button KVM button
Chipset: Intel® C622 chipset
Connector: SUV (Serial/USB/Video) & KVM Connector
Cores: Up to 28 Cores
Cpu: Dual Socket P (LGA 3647) 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors ‡ , 3 UPI up to 10.4GT/s Support CPU TDP 70-205W
Depth: 23.5"
Environmental Spec: Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)
Graphics: Aspeed AST2500 BMC
Height: 6.5"
Hot Swap: 2 Hot-Plug 2.5" NVMe/SAS3/SATA3 drive bays
Ipmi: Support for Intelligent Platform Management Interface (IPMI) v.2.0 via Chassis Management Module (CMM)
Kvm: 1 Front Connector for SMCI KVM Card
Leds: Power LED UID / KVM LED Network Activity LED Fault LED
M 2: 1 PCI-E x4 M.2 and 4 PCI-E x4 M.2 via Mezzanine card
Memory Capacity: 16 DIMM slots Up to 4TB 3DS ECC DDR4-2933MHz † RDIMM/LRDIMM Supports Intel® Optane™ DCPMM ††
Network Controllers: Dual 10G LAN with Intel® X722
Note: ‡ BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
Rohs: RoHS Compliant
Sas: Broadcom 3108 SAS3 (12Gbps) controller; HW RAID 0, 1 support; 2G Cache SAS3 mezz card
Sbi 4129P C2N: Processor Blade SBI-4129P-C2N (Black)
Tpm: 1 TPM Header
Type: 2933 † /2666/2400MHz ECC DDR4 RDIMM/LRDIMM
Weight: 9.5 lbs (4.3 kg)
Width: 1.75"
| Available Colors | Black |
|---|---|
| Bios Features | Plug and Play (PnP) PCI 2.2 ACPI up to 3.0 USB Keyboard support |
| Bios Type | 128Mb SPI Flash EEPROM with AMI® BIOS |
| Buttons | Power On/Off button KVM button |
| Chipset | Intel® C622 chipset |
| Connector | SUV (Serial/USB/Video) & KVM Connector |
| Cores | Up to 28 Cores |
| Cpu | Dual Socket P (LGA 3647) 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors ‡ , 3 UPI up to 10.4GT/s Support CPU TDP 70-205W |
| Depth | 23.5" |
| Environmental Spec | Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
| Graphics | Aspeed AST2500 BMC |
| Height | 6.5" |
| Hot Swap | 2 Hot-Plug 2.5" NVMe/SAS3/SATA3 drive bays |
| Ipmi | Support for Intelligent Platform Management Interface (IPMI) v.2.0 via Chassis Management Module (CMM) |
| Kvm | 1 Front Connector for SMCI KVM Card |
| Leds | Power LED UID / KVM LED Network Activity LED Fault LED |
| M 2 | 1 PCI-E x4 M.2 and 4 PCI-E x4 M.2 via Mezzanine card |
| Memory Capacity | 16 DIMM slots Up to 4TB 3DS ECC DDR4-2933MHz † RDIMM/LRDIMM Supports Intel® Optane™ DCPMM †† |
| Network Controllers | Dual 10G LAN with Intel® X722 |
| Note | ‡ BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R) |
| Rohs | RoHS Compliant |
| Sas | Broadcom 3108 SAS3 (12Gbps) controller; HW RAID 0, 1 support; 2G Cache SAS3 mezz card |
| Sbi 4129P C2N | Processor Blade SBI-4129P-C2N (Black) |
| Tpm | 1 TPM Header |
| Type | 2933 † /2666/2400MHz ECC DDR4 RDIMM/LRDIMM |
| Weight | 9.5 lbs (4.3 kg) |
| Width | 1.75" |
Похожие и взаимозаменяемые
[SBI-4129P-T3N] Twin Blade SBI-4129P-T3N
[SBI-6129P-C3N] Dual-Socket Blade SBI-6129P-C3N
[SBI-4429P-T2N] 2-Socket Blade SBI-4429P-T2N
[SBI-6129P-T3N] Dual-Socket Blade SBI-6129P-T3N
[SBI-6429P-C3N] Dual-Socket Blade SBI-6429P-C3N
[SBI-6429P-T3N] Dual-Socket Blade SBI-6429P-T3N
[SBI-6419P-C3N] Single-Socket Blade SBI-6419P-C3N
[SBI-8149P-C4N] 4-Socket Blade SBI-8149P-C4N