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PowerEdge MX750C

Виртуализация
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Цена по запросу

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Условия и положения
30-дневная гарантия возврата денежных средств
Доставка: 2–3 рабочих дня
Новый Срок поставки: 14 дн.

Характеристики

Ds Port Count Slots Male: 1 server: MLR_INFRA Hp Algo Family Id: 15389 Mktg Model: PE_MX750C Srvr Rack Density: 1 Srvr Socket Cnt: 2
Ds Port Count Slots Male 1
Форм-фактор MLR_INFRA
Hp Algo Family Id 15389
Mktg Model PE_MX750C
Srvr Rack Density 1
Srvr Socket Cnt 2

Базовая частота: 2.40 GHz Кэш L3: 24.0 MB Ядра: 16 TDP: 135 W Базовая частота: 2.30 GHz Кэш L3: 30.0 MB Ядра: 20 TDP: 150 W Базовая частота: 3.00 GHz Кэш L3: 18.0 MB Ядра: 12 Базовая частота: 2.10 GHz Кэш L3: 36.0 MB Ядра: 24 TDP: 165 W Базовая частота: 2.20 GHz Кэш L3: 39.0 MB Ядра: 26 TDP: 185 W Кэш L3: 48.0 MB Ядра: 32 TDP: 205 W Базовая частота: 2.90 GHz
MX750c Sled Enclosure + Motherboard (DAO)
Motherboard ·
MX750c Sled Enclosure + Motherboard
Motherboard ·
Trusted Platform Module 2.0 V6
Trusted Platform Module ·
Trusted Platform Module 1.2 V2
Trusted Platform Module ·
No Trusted Platform Module
Trusted Platform Module ·
Trusted Platform Module 2.0 - China V2
Trusted Platform Module ·
2.5" Chassis with up to 6 SATA/NVMe Hard Drives (No PERC)
Chassis Configuration ·
2.5" Chassis with up to 6 SATA Hard Drives (No NVMe)
Chassis Configuration ·
2.5" Chassis with up to 6 SAS/SATA Hard Drives (No NVMe)
Chassis Configuration ·
2.5" Chassis with up to 6 NVMe Hard Drives
Chassis Configuration ·
2.5" Chassis with up to 4 NVMe Hard Drives
Chassis Configuration ·
2.5" Chassis with up to 4 SATA/NVMe Hard Drives (No PERC)
Chassis Configuration ·
2.5" Chassis with up to 4 SAS/SATA/NVMe Hard Drives
Chassis Configuration ·
Shipped in Chassis
Shipping ·
PowerEdge MX750C Shipping
Shipping ·
PowerEdge MX750C Shipping, BCC
Shipping ·
Shipping Material, Individual Blade, PowerEdge MX750C, EMEA1 Systems Docs
Shipping ·
PowerEdge MX750C Shipping, Individual Blade (APCC/Taiwan)
Shipping ·
Shipping Material, Individual Blade, PowerEdge MX750C, EMEA2 Systems Docs
Shipping ·
PowerEdge MX750C Shipping, Individual Blade (JP/HK/KR/TW)
Shipping ·
Shipping Material, Integrated in MX7000 chassis, PowerEdge MX750C, EMEA1 Systems Docs
Shipping ·
PowerEdge MX750C Shipping, Individual Blade (CN)
Shipping ·
Shipping Material, Integrated in MX7000 chassis, PowerEdge MX750C, EMEA2 Systems Docs
Shipping ·
No Packaging for Blade. Blade installed into Chassis at Factory(CN)
Shipping ·
No Packaging for Blade. Blade installed into Chassis at Factory(All except CN)
Shipping ·
Slot Placement, Label - Slot 1
Slot Placement ·
Slot Placement, Label - Slot 2
Slot Placement ·
Slot Placement, Label - Slot 3
Slot Placement ·
Slot Placement, Label - Slot 4
Slot Placement ·
Slot Placement, Label - Slot 5
Slot Placement ·
Slot Placement, Label - Slot 6
Slot Placement ·
Slot Placement, Label - Slot 7
Slot Placement ·
Slot Placement, Label - Slot 8
Slot Placement ·
Slot Placement, Label - No restriction
Slot Placement ·
Shipped in Chassis
Shipping Material ·
PowerEdge MX7x0C Shipping Material, Air & Liquid Cooled Configuration, X4 and X6
Shipping Material ·
PowerEdge MX7x0C Shipping Material, Air & Liquid Cooled Configuration, X4 and X6, BCC
Shipping Material ·
PowerEdge MX750C Regulatory Label
Regulatory ·
PowerEdge MX750C Regulatory Label, No CE Marking
Regulatory ·
PowerEdge MX750C Regulatory Label, BCC
Regulatory ·
PowerEdge MX750C Regulatory Label, No CE Marking, BCC
Regulatory ·
PowerEdge MX750C Regulatory Label, No CE Marking, CCC2
Regulatory ·
PowerEdge MX750C Regulatory Label, CE Marking
Regulatory ·
PowerEdge MX750C Regulatory Label, No CE Marking, CCC4
Regulatory ·
PowerEdge MX750C Regulatory Label, No CE Marking
Regulatory ·
PowerEdge MX750C Regulatory Label, No CE Marking, APCC/TW
Regulatory ·
PowerEdge MX750C Regulatory Label, CE Marking, CCC2
Regulatory ·
PowerEdge MX750C Regulatory Label, CE Marking, CCC4
Regulatory ·
PowerEdge MX750C Regulatory Label, CE Marking, APCC/Taiwan
Regulatory ·
PowerEdge MX750C Regulatory Label, No CE Marking, No BIS Marking
Regulatory ·
PowerEdge MX750C Regulatory Label, CE Marking, No BIS Marking
Regulatory ·
Intended for EMBEDDED or SERVER APPLIANCE Applications Only
OEM Regulatory ·
Intel® Xeon® Silver 4314 2.4G, 16C/32T, 10.4GT/s, 24M Cache, Turbo, HT (135W) DDR4-2666
Processor · Базовая частота: 2.40 GHz Кэш L3: 24.0 MB Ядра: 16 TDP: 135 W
Intel® Xeon® Silver 4316 2.3G, 20C/40T, 10.4GT/s, 30M Cache, Turbo, HT (150W) DDR4-2666
Processor · Базовая частота: 2.30 GHz Кэш L3: 30.0 MB Ядра: 20 TDP: 150 W
Intel® Xeon® Gold 5317 3G, 12C/24T, 11.2GT/s, 18M Cache, Turbo, HT (150W) DDR4-2933
Processor · Базовая частота: 3.00 GHz Кэш L3: 18.0 MB Ядра: 12 TDP: 150 W
Intel® Xeon® Gold 5318Y 2.1G, 24C/48T, 11.2GT/s, 36M Cache, Turbo, HT (165W) DDR4-2933
Processor · Базовая частота: 2.10 GHz Кэш L3: 36.0 MB Ядра: 24 TDP: 165 W
Intel® Xeon® Gold 5320 2.2G, 26C/52T, 11.2GT/s, 39M Cache, Turbo, HT (185W) DDR4-2933
Processor · Базовая частота: 2.20 GHz Кэш L3: 39.0 MB Ядра: 26 TDP: 185 W
Intel® Xeon® Gold 6312U 2.4G, 24C/48T, 11.2GT/s, 36M Cache, Turbo, HT (185W) DDR4-3200
Processor · Базовая частота: 2.40 GHz Кэш L3: 36.0 MB Ядра: 24 TDP: 185 W
Intel® Xeon® Gold 6314U 2.3G, 32C/64T, 11.2GT/s, 48M Cache, Turbo, HT (205W) DDR4-3200
Processor · Базовая частота: 2.30 GHz Кэш L3: 48.0 MB Ядра: 32 TDP: 205 W
Intel® Xeon® Gold 6326 2.9G, 16C/32T, 11.2GT/s, 24M Cache, Turbo, HT (185W) DDR4-3200
Processor · Базовая частота: 2.90 GHz Кэш L3: 24.0 MB Ядра: 16 TDP: 185 W

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Форм-фактор: MLR_INFRA
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